González-González, José O.

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    Improving changeover times using group technology technique for printed circuit board assembly at electronics manufacturing
    (2019-05-14) González-González, José O.; Seijo-Vidal, Roberto L.; College of Business Administration; Resto-Batalla, Pedro; Zapata-Ramos, Mari L.; Department of Business Administration; Flores-Malavé, José L.
    This project presents how to improve the overall product changeover process for pick-and-place operations using the group technology technique for printed circuit board assembly at electronics manufacturing. It focuses exclusively on the pick-and-place operations given that this process is highly complex as the number of assemblies and components increase. Some of the steps followed were: 1) formation of families by printed circuit board type and side, and yearly demand percentages, 2) group technology software application to matrices of assemblies and components by means of Excel-based Visual Basic Application software code, 3) fixed and variable component assignment using group technology results, 4) distribution of workload among pick-and-place machines, 5) layout rearrangement of pick-and-place equipment, 6) component repetition analysis, and 7) measuring the impact of the methodology focusing on setup, run-time, and capacity improvements. The project demonstrates that it is beneficial to apply group technology, line balancing, and layout rearrangement of the surface mount technology assembly lines. The main results achieved include a 72 percent reduction in setup hours, 82 percent reduction in run-time hours, and a 75 percent reduction of capacity hours required for completing the yearly schedule.