Salomón, Benjamín

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    Capillary underfill manufacturing development and Characterization for 2nd level electronic interconnect processes
    (2004) Salomón, Benjamín; Resto-Batalla, Pedro; College of Engineering; Irizarry, María; González,David; Department of Industrial Engineering; Lorenzo, Edgardo
    The work contained in this study establishes the process framework and methodology for implementing an underfill operation for an electronics manufacturing plant. The investigation explains development of the required process characterization, defines a range of equipment operability, recommends process/equipment parameters and methods, illustrates acceptability criteria and establishes the basis for future practical process development in this area. This document may serve as a general technical reference manual (TRM) for the second level interconnect underfill process as developed for an electronic manufacturing plant. It includes complete process development for all operations related directly to the underfill operation such as underfill dispensing and underfill curing. The methodology presented here may be used as a tool for any future development of these processes or as a template for related underfill projects. The findings in this study indicate that an underfill process while improving second level interconnect board reliability can have a negative impact on manufacturing imperatives by adding cost and overhead. A successful implementation of a cost effective underfill process requires a strong collaborative effort between product designer, manufacturing engineer, underfill and dispensing systems supplier.