Rivera-Soto, Paola

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Assessment of a Au-Sn transient liquid die attach for harsh environments electronics
(2018-05) Rivera-Soto, Paola; Quintero, Pedro O.; College of Engineering; Díaz, Rubén E.; Valentín, Ricky; Perez, Nestor; Department of Mechanical Engineering; Ponce de Leon, Leyda
The constant development of new technologies in the area of power electronics requires new interconnection materials capable of resisting high temperature environments for wide-bandgap semiconductors such as SiC. Die attach interconnections must be capable of resisting high operating temperatures while providing mechanical support, electrical connection, and a path for thermal management. These needs are addressed by the creation of joints via the process of inter diffusion of two metals with different melting points, called solid liquid inter-diffusion. Applying this process, to a gold-tin bond, we have demonstrated the formation of a joint at a temperature ranging from 315 to 340°C, resulting in a sound attach with a higher melting point. The bond was evaluated in four different combinations of varying bonding conditions as a function of time and temperatures of exposure. Lap shear testing, differential scanning calorimetry analysis, and compositional analysis using EDS and SEM images were used to characterize bonding characteristics.