Baez-Ortíz, Rafael J.

Profile Picture

Filters

20201
Reset filters

Settings

Citations

Publication Search Results

Now showing 1 - 1 of 1
  • Thumbnail Image
    Publication
    Metallic phase change materials (mPCMs) stability and compatibility analysis under repetitive melting/solidification cycles
    (2020-07-24) Baez-Ortíz, Rafael J.; Quintero, Pedro O.; College of Engineering; Suárez, O. Marcelo; Pérez, Néstor; Department of Mechanical Engineering; Lorenzo-González, Edgardo
    Metallic phase change materials (mPCMs) have been demonstrated as a potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing the thermal resistance between the device and the cooling system, could result in a significant improvement in thermal management for transient applications. However, many thermo-physical properties of these alloys are still unknown, furthermore, their microstructural stability with repetitive melting/solidification cycles was not guaranteed. In this work, we provide a series of potential mPCMs for thermal management of electronics operating on a wide range of application temperatures, followed by an experimental investigation of microstructural and thermo-physical stability of these materials under repetitive melting solidification cycles. Results of the effect of cyclic thermal loading of theses alloys on the melting behavior and latent heat of fusion are discussed. In the second phase of analysis, the alloys were again subjected to thermal cycles on a gold-plated substrate, to evaluate the thermophysical characteristics under environmental conditions closer to that of electronic packaging. Thermal stability of 51.0wt.%In-32.5wt.%Bi-16.5wt.%Sn, 50wt.%Bi26.7wt%Pb-13.3wt%Sn-10wt%Cd and 57-wt.%Bi-26wt.%In- 17wt.%Sn alloys, as potential mid-temperature mPCM, were evaluated. The results suggested that these mPCM maintain their thermo-physical stability over large periods of thermal cycles.