Publication:
On the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industry

dc.contributor.advisor Valentín, Ricky
dc.contributor.author Renta-Rosa, Lorraine M.
dc.contributor.college College of Engineering en_US
dc.contributor.committee Cáceres, Pablo
dc.contributor.committee Quintero, Pedro
dc.contributor.department Department of Mechanical Engineering en_US
dc.contributor.representative González, David
dc.date.accessioned 2018-05-16T16:26:57Z
dc.date.available 2018-05-16T16:26:57Z
dc.date.issued 2009
dc.description.abstract A modeling approach based on physics of failure is presented that quantifies the interactions between different thermal cycles applied to Ball Grid Arrays (BGA). The approach is formulated at the microscale, incorporating physical mechanisms of intermetallics, and at the macroscale, capturing the creep phenomenon as dominant failure driver. The prediction trends agree with experimental results, confirming that the dominant damage switches have been captured in the Finite Element Models. Both macroscale and microscale damage models are applied to predict the durability of two BGA structures: backward compatible SAC balls soldered to eutectic SnPb paste, and reballed eutectic SnPb balls soldered to eutectic SnPb paste. Results show that re-balled cases have higher inelastic energy density per cycle averaged over damage volume. Results also show that the inelastic energy density is higher across the bulk of the improperly mixed backward compatible solder balls when compared to properly mixed backward compatible solder balls. en_US
dc.description.abstract Se presenta un enfoque de modelaje basado en física de falla que cuantifica interacciones entre diferentes ciclos termales aplicados a Matrices de Rejilla de Bolas (BGA). El enfoque es formulado en modelos a microescala, incorporando mecanismos físicos de intermetálicos, y macroescala, capturando el pandeo como gestor dominante de falla. Tendencias de predicción concuerdan con resultados experimentales, confirmando que parámetros de daño dominantes se han capturado en los Modelos de Elementos Finitos. Ambos modelos son aplicados para predecir la durabilidad de dos estructuras BGA: bolas de compatibilidad descendente SAC soldadas en pasta SnPb eutéctica, y bolas re-ensambladas de SnPb eutéctico soldadas en pasta SnPb eutéctica. Resultados muestran que casos re-ensamblados tienen densidad de energía por ciclo promediada sobre volumen dañado mayores. También muestran que densidad de energía inelástica es mayor en el grueso de las bolas de soldaduras de compatibilidad descendente no mezcladas comparadas con bolas de soldaduras de compatibilidad descendente mezcladas. en_US
dc.description.graduationYear 2009 en_US
dc.identifier.uri https://hdl.handle.net/20.500.11801/584
dc.language.iso en en_US
dc.rights.holder (c) 2009 Lorraine M. Renta Rosa en_US
dc.rights.license All rights reserved en_US
dc.subject Ball Grid Arrays en_US
dc.subject.lcsh Lead-free electronics manufacturing processes en_US
dc.subject.lcsh Ball grid array technology en_US
dc.subject.lcsh Eutectics en_US
dc.subject.lcsh Lead--Creep en_US
dc.subject.lcsh Intermetallic compounds--Thermal properties en_US
dc.title On the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industry en_US
dc.type Thesis en_US
dspace.entity.type Publication
thesis.degree.discipline Mechanical Engineering en_US
thesis.degree.level M.S. en_US
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