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dc.contributor.advisorVélez-Reyes, Miguel
dc.contributor.authorOrtiz-Rodríguez, José M.
dc.date.accessioned2019-05-14T14:54:11Z
dc.date.available2019-05-14T14:54:11Z
dc.date.issued2004
dc.identifier.urihttps://hdl.handle.net/20.500.11801/2147
dc.description.abstractAn electrothermal model for a power electronic module is presented. The model is developed by representing the internal thermal behavior of the module as a RC network using an electrical circuit equivalent for the thermal heat conduction equation in one dimension. The physical characteristics of the module, like thermal properties of its constituents and all its dimensions, are used to subdivide its structure into a finite number of thermal components or nodes. To validate the model, two experiments were made: a train of high-power pulses was applied to obtain a fast-transient response of the innermost layers close to the semiconductor junctions, and a constant low-power level was applied to obtain a slow-transient response of different points located throughout the module plus its heat dissipation elements. Simulations performed with the module model showed an acceptable agreement with the acquired experimental measurements.en_US
dc.description.abstractUn modelo electrotermal para un módulo de electrónica de potencia es presentado. El modelo es desarrollado representando el comportamiento termal interno del módulo como una red RC usando un circuito eléctrico equivalente para la ecuación de conducción termal en una dimensión. Las características físicas del módulo, como las propiedades termales de sus constituyentes y todas sus dimensiones, son usadas para subdividir la estructura en un número finito de componentes termales o nodos. Para validar el modelo, dos experimentos fueron realizados: un tren de pulsos de alta potencia fue aplicado para obtener una respuesta de transiente rápida de las capas más internas cercanas a las juntas de los semiconductores, y un nivel constante de baja potencia fue aplicado para obtener una respuesta de transiente lenta para diferentes puntos localizados a través del módulo más sus elementos de disipación de calor. Simulaciones realizadas con el modelo del módulo mostraron una concordancia aceptable con las medidas experimentales adquiridas.en_US
dc.description.sponsorshipNational Science Foundation, Award Number EEC-9731677.en_US
dc.language.isoEnglishen_US
dc.subjectModelingen_US
dc.subjectpower electronic moduleen_US
dc.titleElectro-thermal modeling of a power electronic moduleen_US
dc.typeThesisen_US
dc.rights.licenseAll rights reserveden_US
dc.rights.holder(c) 2004 José Miguel Ortiz-Rodríguezen_US
dc.contributor.committeeJiménez, Manuel
dc.contributor.committeeVenkatesan, Krishnaswami
dc.contributor.representativeMendez, Hector
thesis.degree.levelM.S.en_US
thesis.degree.disciplineElectrical Engineeringen_US
dc.contributor.collegeCollege of Engineeringen_US
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.description.graduationYear2004en_US


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  • Theses & Dissertations
    Items included under this collection are theses, dissertations, and project reports submitted as a requirement for completing a graduate degree at UPR-Mayagüez.

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