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dc.contributor.advisorJiménez Cedeño, Manuel
dc.contributor.authorAparicio-Moscoso, Yohan Aldemar
dc.description.abstractThis thesis presents the development of a mathematical model to predict misalignment of Small Outline Integrated Circuits (SOIC) packages in the presence of a dielectric fluid, when manipulated by a pick-and-place system. Specifically, the mathematical model included a set of analysis required with different thematic hydrodynamics of dielectric fluids, which influence the SOIC package while going through distinct physical media with different densities. The effectiveness of this mathematical model in order to reduce test times under precise and constant movements, was evaluated by means of parametric tests performed on three different SOIC models, using three types of dielectric fluids of different characteristics, to meet the requirements of experimental design methodology. The measurement execution was performed automatically through a sequential control software for movements and a data collection system designed to verify the correct position for each SOIC model in the ZIF socket. The analysis of the results reveals a high percentage of success of the mathematical model applied to similar behavior patterns in the tested systems.en_US
dc.description.abstractEsta tesis presenta el desarrollo de un modelo matem atico que puede predecir la desalineaci on de encapsulados de circuitos integrados de peque~no contorno (SOIC por sus siglas en ingl es), cuando se manipulan mediante un sistema automatizado de selecci on y colocaci on en presencia de un uido diel ectrico. Espec camente, el modelo matem atico incluye una serie de an alisis con diferentes tem aticas en hidrodin amica de uidos diel ectricos que in uyen en el encapsulado mientras atraviesa varios medios f sicos con diferentes densidades. La efectividad de este modelo matem atico para reducir los tiempos de prueba bajo movimientos precisos y constantes, fue evaluada mediante pruebas param etricas realizadas a tres diferentes modelos de SOICs, usando tres tipos de uido diel ectrico de distintas caracter sticas para cumplir con los requerimientos de una metodolog a de dise~no experimental. La ejecuci on de la medici on se realiz o de forma automatizada a trav es de un software de control secuencial para los movimientos y un sistema de recolecci on de datos dise~nado para comprobar la correcta posici on para cada modelo de SOIC en el ZIF (Zero Insertion Force) socket. El an alisis de los resultados revela un gran porcentaje de acierto del modelo matem atico aplicado a similares patrones de comportamiento en los sistemas puestos a prueba.en_US
dc.description.sponsorshipThanks to Texas Instruments for their financial support through the UPRM-TI collaborative program. (The opinions expressed in this thesis are those of the author and do not represent the official possession of the TI sponsoring organization)en_US
dc.rightsCC0 1.0 Universal*
dc.subjectDielectric fluiden_US
dc.subjectForce analysisen_US
dc.subjectHigh voltage testingen_US
dc.subjectSOIC packageen_US
dc.subjectMisalignment Vs Velocityen_US
dc.subject.lcshIntegrated circuits -- Mathematical modelsen_US
dc.subject.lcshIntegrated circuits -- Computer simulationen_US
dc.titleA mathematical model to predict misalignment of SOIC packages in the presence of a dielectric fluiden_US
dc.title.alternativeModelo matemático para predecir la desalineación de dispositivos encapsulados SOIC en presencia de un fluido dieléctricoen_US
dc.rights.holder(c) 2020 Yohan Aldemar Aparicio Moscosoen_US
dc.contributor.committeePalomera García, Rogelio
dc.contributor.committeeSerrano Rivera, Guillermo J.
dc.contributor.representativeRúa De La Asunción, Armando J. Engineeringen_US
dc.contributor.collegeCollege of Engineeringen_US
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US

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    Items included under this collection are theses, dissertations, and project reports submitted as a requirement for completing a graduate degree at UPR-Mayagüez.

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CC0 1.0 Universal
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