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dc.contributor.advisorValentín, Ricky
dc.contributor.authorRenta-Rosa, Lorraine M.
dc.date.accessioned2018-05-16T16:26:57Z
dc.date.available2018-05-16T16:26:57Z
dc.date.issued2009
dc.identifier.urihttps://hdl.handle.net/20.500.11801/584
dc.description.abstractA modeling approach based on physics of failure is presented that quantifies the interactions between different thermal cycles applied to Ball Grid Arrays (BGA). The approach is formulated at the microscale, incorporating physical mechanisms of intermetallics, and at the macroscale, capturing the creep phenomenon as dominant failure driver. The prediction trends agree with experimental results, confirming that the dominant damage switches have been captured in the Finite Element Models. Both macroscale and microscale damage models are applied to predict the durability of two BGA structures: backward compatible SAC balls soldered to eutectic SnPb paste, and reballed eutectic SnPb balls soldered to eutectic SnPb paste. Results show that re-balled cases have higher inelastic energy density per cycle averaged over damage volume. Results also show that the inelastic energy density is higher across the bulk of the improperly mixed backward compatible solder balls when compared to properly mixed backward compatible solder balls.en_US
dc.description.abstractSe presenta un enfoque de modelaje basado en física de falla que cuantifica interacciones entre diferentes ciclos termales aplicados a Matrices de Rejilla de Bolas (BGA). El enfoque es formulado en modelos a microescala, incorporando mecanismos físicos de intermetálicos, y macroescala, capturando el pandeo como gestor dominante de falla. Tendencias de predicción concuerdan con resultados experimentales, confirmando que parámetros de daño dominantes se han capturado en los Modelos de Elementos Finitos. Ambos modelos son aplicados para predecir la durabilidad de dos estructuras BGA: bolas de compatibilidad descendente SAC soldadas en pasta SnPb eutéctica, y bolas re-ensambladas de SnPb eutéctico soldadas en pasta SnPb eutéctica. Resultados muestran que casos re-ensamblados tienen densidad de energía por ciclo promediada sobre volumen dañado mayores. También muestran que densidad de energía inelástica es mayor en el grueso de las bolas de soldaduras de compatibilidad descendente no mezcladas comparadas con bolas de soldaduras de compatibilidad descendente mezcladas.en_US
dc.language.isoenen_US
dc.subjectBall Grid Arraysen_US
dc.subject.lcshLead-free electronics manufacturing processesen_US
dc.subject.lcshBall grid array technologyen_US
dc.subject.lcshEutecticsen_US
dc.subject.lcshLead--Creepen_US
dc.subject.lcshIntermetallic compounds--Thermal propertiesen_US
dc.titleOn the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industryen_US
dc.typeThesisen_US
dc.rights.licenseAll rights reserveden_US
dc.rights.holder(c) 2009 Lorraine M. Renta Rosaen_US
dc.contributor.committeeCáceres, Pablo
dc.contributor.committeeQuintero, Pedro
dc.contributor.representativeGonzález, David
thesis.degree.levelM.S.en_US
thesis.degree.disciplineMechanical Engineeringen_US
dc.contributor.collegeCollege of Engineeringen_US
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.description.graduationYear2009en_US


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