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dc.contributor.advisorGonzález, Jorge E.
dc.contributor.authorHernández-Mora, Madelaine
dc.date.accessioned2018-06-06T16:50:19Z
dc.date.available2018-06-06T16:50:19Z
dc.date.issued2004
dc.identifier.urihttps://hdl.handle.net/20.500.11801/745
dc.description.abstractThis work presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an Integrated Power Electronics Module (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. By applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Transient results of the model were validated using FLOTHERM 3.1TM, a thermal analysis software tool. Two experimental set-up, for low- and high-speed thermal response, were developed. Comparisons between thermal model results and experimental data are also presented to demonstrate the need to obtain the electrical performance and to make the electrothermal coupling. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient thermal analysis software tools.
dc.description.abstractEste trabajo presenta un modelo matemático reducido usando una formulación numérica práctica del comportamiento térmico de un Módulo Integrado de Electrónica de Potencia (IPEM). Este modelo está basado sobre la expansión del Método de la Capacitancia Térmica de un Conglomerado (LTCM), en el cual el número de las variables envueltas en el análisis de transferencia de calor es reducido a solo el tiempo. Aplicando este método, un modelo simple, no espacial, no lineal es obtenido. Los resultados transitorios del modelo son validados contra resultados de un software de análisis térmico, FLOTHERM 3.1TM. Dos arreglos experimentales, para respuestas térmicas de baja y alta velocidad, fueron desarrollados. Comparaciones entre los resultados del modelo térmico y los datos experimentales son también presentados para demostrar la necesidad de obtener el comportamiento eléctrico y hacer el acople electrotérmico en el análisis electrotérmico. Se demuestra en esta investigación que la metodología desarrollada presenta una alternativa para reducir el nivel de complejidad desarrollado en softwares comerciales de análisis térmico transitorio y multidimensional.
dc.description.sponsorshipNational Science Foundation Engineering Research Centers Program under grant EEC-9731677en_US
dc.language.isoenen_US
dc.subjectheat transferen_US
dc.subject.lcshPower electronicsen_US
dc.subject.lcshLumped elements (Electronics)en_US
dc.subject.lcshIntegrated circuitsen_US
dc.subject.lcshThermal analysisen_US
dc.titleModeling of the thermal behavior of a power electronic moduleen_US
dc.typeThesisen_US
dc.rights.licenseAll rights reserveden_US
dc.rights.holder(c) 2004 Madelaine Hernández Moraen_US
dc.contributor.committeeDukhan, Nihad
dc.contributor.committeeVélez Reyes, Miguel
dc.contributor.representativeCruz Emeric, Jorge A.
thesis.degree.levelM.S.en_US
thesis.degree.disciplineMechanical Engineeringen_US
dc.contributor.collegeCollege of Engineeringen_US
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.description.graduationYear2004en_US


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  • Theses & Dissertations
    Items included under this collection are theses, dissertations, and project reports submitted as a requirement for completing a graduate degree at UPR-Mayagüez.

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