Publication:
Automated temperature trimming for mismatch and process variations in bandgap voltage reference

dc.contributor.advisor Serrano, Guillermo
dc.contributor.author De La Cruz-Hernández, Gabriel E.
dc.contributor.college College of Engineering en_US
dc.contributor.committee Ducoudray, Gladys O.
dc.contributor.committee Palomera, Rogelio
dc.contributor.committee Colom, Jose G.
dc.contributor.department Department of Electrical and Computer Engineering en_US
dc.contributor.representative Hernández, Carlos
dc.date.accessioned 2019-04-15T12:04:21Z
dc.date.available 2019-04-15T12:04:21Z
dc.date.issued 2018-05
dc.description.abstract This document shows the work that has been realized to design and simulate an integrated circuit that is capable of correcting mismatch and process variations using an automated temperature trimming circuit. The system will correct Bandgap References to have a temperature coefficient (TC) from 10 to 35 ppm from -40º to 100 ºC. To achieve this, the integrated circuit has an on-chip heating element, the output of the Bandgap Reference is tracked at all moments using a slope detector circuit to detect the maximum of the voltage reference. Using the slope detector as feedback, a logic circuit detects the change in sign of the slope. The trimming circuit resolution has been selected to ensure that the BGR will result in a more accurate first order cancellation; resulting in a TC of less than 40 ppm. To validate the circuit Monte Carlo simulation has been used; that will recreate mismatch and process variations to the BGR. en_US
dc.description.abstract Este documento muestra el trabajo que se ha realizado para diseñar y simular un circuito integrado que es capaz de corregir variaciones en proceso y errores de tamaño utilizando un circuito de ajuste de temperatura automático. El sistema corregirá las referencias de Bandgap para tener un coeficiente de temperatura (TC) de 10 a 35 ppm desde -40º hasta 100º C. Para lograr esto, el circuito integrado tiene un elemento de calentamiento en el chip, la salida de la referencia Bandgap se monitorea en todo momento usando un circuito detector de pendiente para detectar el máximo de la referencia de voltaje. Usando el detector de pendiente como retroalimentación, un circuito lógico detecta el cambio en el signo de la pendiente. La resolución del circuito de ajuste se ha seleccionado para garantizar que el BGR dé como resultado una cancelación más precisa de primer orden; dando como resultado una TC de menos de 40 ppm. Para validar el circuito, se ha realizado simulación Monte Carlo; que recreará las discrepancias y las variaciones de proceso en el BGR. en_US
dc.description.graduationSemester Spring en_US
dc.description.graduationYear 2018 en_US
dc.identifier.uri https://hdl.handle.net/20.500.11801/1908
dc.language.iso en en_US
dc.rights.holder (c) 2018 Gabriel E. De La Cruz Hernández en_US
dc.rights.license All rights reserved en_US
dc.subject Automated temperature trimming circuit - Bandgap reference en_US
dc.subject.lcsh Voltage references en_US
dc.title Automated temperature trimming for mismatch and process variations in bandgap voltage reference en_US
dc.type Thesis en_US
dspace.entity.type Publication
thesis.degree.discipline Electrical Engineering en_US
thesis.degree.level M.S. en_US
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