Publication:
A mathematical model to predict misalignment of SOIC packages in the presence of a dielectric fluid

dc.contributor.advisor Jiménez-Cedeño, Manuel
dc.contributor.author Aparicio-Moscoso, Yohan Aldemar
dc.contributor.college College of Engineering en_US
dc.contributor.committee Palomera-García, Rogelio
dc.contributor.committee Serrano-Rivera, Guillermo J.
dc.contributor.department Department of Electrical and Computer Engineering en_US
dc.contributor.representative Rúa De La Asunción, Armando J.
dc.date.accessioned 2020-12-11T17:39:32Z
dc.date.available 2020-12-11T17:39:32Z
dc.date.issued 2020-12-04
dc.description.abstract This thesis presents the development of a mathematical model to predict misalignment of Small Outline Integrated Circuits (SOIC) packages in the presence of a dielectric fluid, when manipulated by a pick-and-place system. Specifically, the mathematical model included a set of analysis required with different thematic hydrodynamics of dielectric fluids, which influence the SOIC package while going through distinct physical media with different densities. The effectiveness of this mathematical model in order to reduce test times under precise and constant movements, was evaluated by means of parametric tests performed on three different SOIC models, using three types of dielectric fluids of different characteristics, to meet the requirements of experimental design methodology. The measurement execution was performed automatically through a sequential control software for movements and a data collection system designed to verify the correct position for each SOIC model in the ZIF socket. The analysis of the results reveals a high percentage of success of the mathematical model applied to similar behavior patterns in the tested systems. en_US
dc.description.abstract Esta tesis presenta el desarrollo de un modelo matem atico que puede predecir la desalineaci on de encapsulados de circuitos integrados de peque~no contorno (SOIC por sus siglas en ingl es), cuando se manipulan mediante un sistema automatizado de selecci on y colocaci on en presencia de un uido diel ectrico. Espec camente, el modelo matem atico incluye una serie de an alisis con diferentes tem aticas en hidrodin amica de uidos diel ectricos que in uyen en el encapsulado mientras atraviesa varios medios f sicos con diferentes densidades. La efectividad de este modelo matem atico para reducir los tiempos de prueba bajo movimientos precisos y constantes, fue evaluada mediante pruebas param etricas realizadas a tres diferentes modelos de SOICs, usando tres tipos de uido diel ectrico de distintas caracter sticas para cumplir con los requerimientos de una metodolog a de dise~no experimental. La ejecuci on de la medici on se realiz o de forma automatizada a trav es de un software de control secuencial para los movimientos y un sistema de recolecci on de datos dise~nado para comprobar la correcta posici on para cada modelo de SOIC en el ZIF (Zero Insertion Force) socket. El an alisis de los resultados revela un gran porcentaje de acierto del modelo matem atico aplicado a similares patrones de comportamiento en los sistemas puestos a prueba. en_US
dc.description.graduationSemester Fall en_US
dc.description.graduationYear 2020 en_US
dc.description.sponsorship Thanks to Texas Instruments for their financial support through the UPRM-TI collaborative program. (The opinions expressed in this thesis are those of the author and do not represent the official possession of the TI sponsoring organization) en_US
dc.identifier.uri https://hdl.handle.net/20.500.11801/2709
dc.language.iso en en_US
dc.rights CC0 1.0 Universal *
dc.rights.holder (c) 2020 Yohan Aldemar Aparicio Moscoso en_US
dc.rights.uri http://creativecommons.org/publicdomain/zero/1.0/ *
dc.subject Dielectric fluid en_US
dc.subject Force analysis en_US
dc.subject High voltage testing en_US
dc.subject SOIC package en_US
dc.subject Misalignment Vs Velocity en_US
dc.subject.lcsh Integrated circuits -- Mathematical models en_US
dc.subject.lcsh Integrated circuits -- Computer simulation en_US
dc.subject.lcsh Hydrodynamics en_US
dc.subject.lcsh Dielectrics en_US
dc.subject.lcsh Fluids en_US
dc.title A mathematical model to predict misalignment of SOIC packages in the presence of a dielectric fluid en_US
dc.title.alternative Modelo matemático para predecir la desalineación de dispositivos encapsulados SOIC en presencia de un fluido dieléctrico en_US
dc.type Thesis en_US
dspace.entity.type Publication
thesis.degree.discipline Electrical Engineering en_US
thesis.degree.level M.S. en_US
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