Publication:
On the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industry

Thumbnail Image
Authors
Renta-Rosa, Lorraine M.
Embargoed Until
Advisor
Valentín, Ricky
College
College of Engineering
Department
Department of Mechanical Engineering
Degree Level
M.S.
Publisher
Date
2009
Abstract
A modeling approach based on physics of failure is presented that quantifies the interactions between different thermal cycles applied to Ball Grid Arrays (BGA). The approach is formulated at the microscale, incorporating physical mechanisms of intermetallics, and at the macroscale, capturing the creep phenomenon as dominant failure driver. The prediction trends agree with experimental results, confirming that the dominant damage switches have been captured in the Finite Element Models. Both macroscale and microscale damage models are applied to predict the durability of two BGA structures: backward compatible SAC balls soldered to eutectic SnPb paste, and reballed eutectic SnPb balls soldered to eutectic SnPb paste. Results show that re-balled cases have higher inelastic energy density per cycle averaged over damage volume. Results also show that the inelastic energy density is higher across the bulk of the improperly mixed backward compatible solder balls when compared to properly mixed backward compatible solder balls.

Se presenta un enfoque de modelaje basado en física de falla que cuantifica interacciones entre diferentes ciclos termales aplicados a Matrices de Rejilla de Bolas (BGA). El enfoque es formulado en modelos a microescala, incorporando mecanismos físicos de intermetálicos, y macroescala, capturando el pandeo como gestor dominante de falla. Tendencias de predicción concuerdan con resultados experimentales, confirmando que parámetros de daño dominantes se han capturado en los Modelos de Elementos Finitos. Ambos modelos son aplicados para predecir la durabilidad de dos estructuras BGA: bolas de compatibilidad descendente SAC soldadas en pasta SnPb eutéctica, y bolas re-ensambladas de SnPb eutéctico soldadas en pasta SnPb eutéctica. Resultados muestran que casos re-ensamblados tienen densidad de energía por ciclo promediada sobre volumen dañado mayores. También muestran que densidad de energía inelástica es mayor en el grueso de las bolas de soldaduras de compatibilidad descendente no mezcladas comparadas con bolas de soldaduras de compatibilidad descendente mezcladas.
Keywords
Ball Grid Arrays
Cite
Renta-Rosa, L. M. (2009). On the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industry [Thesis]. Retrieved from https://hdl.handle.net/20.500.11801/584