Molina-Torregrosa, Manuel M.

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    Structural transformations of low temperature, pressureless sintered silver nanoparticles for die attach interconnections
    (2012) Molina-Torregrosa, Manuel M.; Quintero, Pedro O.; College of Engineering; Perales Pérez, Oscar Juan; Valentín, Ricky; Department of Mechanical Engineering; Camacho Padrón, Beatriz I.
    The new generation of wide-bandgap semiconductor devices has proved superb performance among high power electronic devices, demonstrating total functionality at temperatures above 500°C. However, they are limited by current die attach technology which mechanically secures them just up to ~250°C. Reliability problems due to thermal stresses and thermal stability are prevalent reasons. This project proposes a die attach solution using pressureless sintering of silver (Ag) nanoparticles to produce a compact material at relatively low processing temperatures, but with high operating temperature capabilities. Formulating the Ag nanoparticles in a simple dispersant medium and subjecting the resulting paste to sintering tests at different temperatures, dwell times, and environments, was done for the understanding of its evolution mechanisms. Conclusive results were obtained through microstructural analysis and characterization, via SEM examinations, thermal evaluations, qualitative appraisal, and stereological analysis. An exhaustive analysis of the process was carried out from the nano to the macro length scale suggesting the criticality of the mesoscale, where functional interactions were linked. As result, a promising method is suggested by mixing different particles sizes, coating states, and environments, to enhance the sintering results at 300°C, so that a reliable die attach for harsh environments can be obtained.