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dc.contributor.advisorVélez-Reyes, Miguel
dc.contributor.authorRodríguez-Rodríguez, José J.
dc.date.accessioned2019-05-14T14:54:12Z
dc.date.available2019-05-14T14:54:12Z
dc.date.issued2004
dc.identifier.urihttps://hdl.handle.net/20.500.11801/2152
dc.description.abstractA lumped parameter thermal model for a multi-chip power module is presented based in the physical and geometrical characteristics of the module. The model is developed using the thermal component approach. The model is implemented in SABER and integrated with temperature dependent device models and other thermal component models to develop an electro-thermal model for a three-phase inverter. This report presents model development, implementation in SABER, simulation results, and calibration using experimental data. The model exhibit excellent matching of the temperature in the junction of the devices and good matching in the temperature in the heat sink which permits dynamic simulations of power electronic designs.en_US
dc.description.abstractUn modelo termal de parámetros conglomerados para un modulo de potencia múltiples chips es presentado basado en las características físicas y geométricas del modulo. Este modelo fue desarrollado usando el método de componentes termales. El modelo fue implementado en SABER e integrado con modelos de dispositivos dependientes de temperatura y otros modelos de componentes termales para desarrollar un modelo electro-termal para un invertidor trifásico. Este reporte presenta el desarrollo, implementación del modelo en SABER, resultados de simulaciones y calibración usando información experimental. El modelo presenta excelente concordancia con la temperatura de junta de los dispositivos además de buena concordancia en la temperatura del disipador de calor lo que permite simulaciones de diseños de electrónica de potencia.en_US
dc.description.sponsorshipNational Science Foundation under Award Number EEC-9731677en_US
dc.language.isoEnglishen_US
dc.subjectElectro-thermal modelen_US
dc.subjectmulti-chipen_US
dc.subjectpower electronic moduleen_US
dc.titleDevelopment of an electro-thermal model for a multi-chip igbt power electronic moduleen_US
dc.typeThesisen_US
dc.rights.licenseAll rights reserveden_US
dc.rights.holder(c) 2004 José J. Rodríguez-Rodríguezen_US
dc.contributor.committeeJiménez Cedeno, Manuel
dc.contributor.committeeVenkatesan, Krishnaswami
dc.contributor.representativeOrama Exclusa, Lionel
thesis.degree.levelM.S.en_US
thesis.degree.disciplineElectrical Engineeringen_US
dc.contributor.collegeCollege of Engineeringen_US
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.description.graduationYear2004en_US


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